Title:
FLEXIBLE RESIN-FORMING CURABLE RESIN COMPOSITION, RESIN FILM, ELECTRIC CIRCUIT BODY AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2019182896
Kind Code:
A
Abstract:
To provide a flexible resin layer-forming resin composition that has sufficient flexibility, elasticity and transparency, and has high surface free energy, and a resin film, an electric circuit body and a semiconductor device including the same.SOLUTION: A flexible resin-forming curable resin composition contains (A) a styrenic elastomer, (B) a polymerizable compound, (C) a polymerization initiator and (D) maleic acid anhydride.SELECTED DRAWING: None
Inventors:
SHIBATA TOMOAKI
OTAKE SHUNSUKE
IMAZU HIROKI
TENDO KAZUYOSHI
OTAKE SHUNSUKE
IMAZU HIROKI
TENDO KAZUYOSHI
Application Number:
JP2018070748A
Publication Date:
October 24, 2019
Filing Date:
April 02, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F2/44; C08F2/46; H01L23/29; H01L23/31; H05K1/03; H05K3/28
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Junichiro Sakamaki
Yoshinori Shimizu
Hiroyuki Hirano
Junichiro Sakamaki