Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2019185025
Kind Code:
A
Abstract:
To provide a photosensitive resin composition excellent in a coating property and a film forming property as well as excellent in developability and resolution and capable of improving productivity of a dry film.SOLUTION: The photosensitive resin composition of the present invention comprises a carboxyl group-containing resin A having a weight average molecular weight of 1500 or more and less than 5000, a carboxyl group-containing resin B having a weight average molecular weight of 5000 or more and 150000 or less, an epoxy resin, a photopolymerization initiator, a photosensitive monomer, and an inorganic filler, in which a compounding ratio of the carboxyl group-containing resin A to the carboxyl group-containing resin B is 6:4 to 3:7 on a mass basis, and the content of the inorganic filler is 40 to 300 parts with respect to 100 parts of the carboxyl group-containing resin included in the photosensitive resin composition.SELECTED DRAWING: None
Inventors:
SUZUKI ERI
TAKII YOJI
OKADA KAZUYA
YODA KENJI
UEDA CHIHO
TAKII YOJI
OKADA KAZUYA
YODA KENJI
UEDA CHIHO
Application Number:
JP2019041436A
Publication Date:
October 24, 2019
Filing Date:
March 07, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
G03F7/004; G03F7/029; G03F7/038; H05K3/28
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Mari Asano
Kazuma Kojima
Takaaki Suemori
Yukitaka Nakamura
Satoru Asakura
Mari Asano
Kazuma Kojima
Takaaki Suemori