Title:
SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2019186300
Kind Code:
A
Abstract:
To provide a semiconductor light-emitting device and manufacturing method therefor, capable of suppressing generation of light leakage (glare) of a non-light-emitting part around a light-emitting part.SOLUTION: A white LED device includes: a mounted substrate 1; blue LED elements 2-1, 2-2 flip-flop mounted on the mounted substrate 1; a wavelength conversion member (a plate) 4 bonded by a transparent adhesive layer 3 such as silicon resin on the blue LED elements 2-1, 2-2; a frame 5 surrounding circumferences of the blue LED elements 2-1, 2-2 and the wavelength conversion member 4; and a light reflection adjustment member 6 as a covering member provided between the blue LED elements 2-1, 2-2, the wavelength conversion member 4 and the frame 5.SELECTED DRAWING: Figure 1
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Inventors:
HARADA MITSUNORI
TACHIBANA YOSHIORI
ANDO KEN
TACHIBANA YOSHIORI
ANDO KEN
Application Number:
JP2018072290A
Publication Date:
October 24, 2019
Filing Date:
April 04, 2018
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
H01L33/60; H01L21/56; H01L23/28; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP2012251031A | 2012-12-20 | |||
| JP2010219324A | 2010-09-30 | |||
| JP2015138838A | 2015-07-30 | |||
| JP2013016588A | 2013-01-24 | |||
| JP2010157638A | 2010-07-15 |
Attorney, Agent or Firm:
Shozo Igarashi