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Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND COMPUTER READABLE RECORDING MEDIUM
Document Type and Number:
Japanese Patent JP2019186405
Kind Code:
A
Abstract:
To provide a substrate processing apparatus, a substrate processing method and a computer readable recording medium capable of restraining metallic contamination incident to use of a metal-containing coat.SOLUTION: A substrate processing apparatus includes: a deposition part configured to form a coat containing a metal on a surface of a substrate; a coat cleansing part configured to cleanse a peripheral part of the substrate; and a control part. The control part executes to control the deposition part so as to form a coat on the surface of the substrate, to control the coat cleansing part so as to supply first medicinal solution having a function for melting the coat, to a first position at the peripheral part of the substrate, and to control the coat cleansing part so as to supply second medicinal solution having a function for melting the coat, to a second position at the peripheral part of the substrate, closer to the peripheral side of the substrate than the first position, after desiccation of the coat melted by the first medicinal solution.SELECTED DRAWING: Figure 14

Inventors:
MIZUNOURA HIROSHI
SANO YOHEI
KAWAKAMI SHINICHIRO
Application Number:
JP2018076288A
Publication Date:
October 24, 2019
Filing Date:
April 11, 2018
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; G03F7/16; H01L21/304
Domestic Patent References:
JP2018049987A2018-03-29
JP2008103660A2008-05-01
JPH06250380A1994-09-09
JP2007013162A2007-01-18
Foreign References:
WO2018031896A12018-02-15
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Toshiaki Matsuzawa