Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019186407
Kind Code:
A
Abstract:
To provide a semiconductor device including multiple capacitors of different capacities, while restraining increase in the production process.SOLUTION: On a board 1, multiple capacitors 31-34 are constituted by laminating multiple insulation films 21-24 and multiple wiring parts 31-34 alternately. Respective capacitors C1-C4 are constituted of the wiring parts on the board 1 side as first electrodes C1a-C4a, and the wiring parts on the opposite sides to the board 1 while sandwiching the first electrodes C1a-C4a as second electrodes C1b-C4b. In the respective capacitors C1-C4, one of the first and second electrodes C1a-C4a, C1b-Cba are constituted of the same wiring part 33, and since the intervals of the first and second electrodes C1a-C4a, C1b-Cba are different, the capacities are different. Out of the first and second electrodes C1a-C4a, C1b-Cba, the electrodes constituted of the same wiring part 33 are covered with the insulation films 22, 23, and the ends are located on the same plane.SELECTED DRAWING: Figure 1
Inventors:
FUJIWARA TAKESHI
NOMA SEIJI
NOMA SEIJI
Application Number:
JP2018076324A
Publication Date:
October 24, 2019
Filing Date:
April 11, 2018
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L21/822; H01L21/3213; H01L21/768; H01L27/04
Domestic Patent References:
| JP2015028974A | 2015-02-12 | |||
| JP2008198749A | 2008-08-28 | |||
| JP2016046323A | 2016-04-04 | |||
| JP2008263599A | 2008-10-30 | |||
| JP2001267320A | 2001-09-28 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office