Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2019186452
Kind Code:
A
Abstract:
To realize, in a polishing device, an economical polishing process in which slurry consumption is reduced by spreading slurry over the entire polishing surface of a polishing pad while the supply of slurry is reduced.SOLUTION: A polishing device 1 for a wafer comprises: a wafer holding table 3; polishing means 76 that rotates a polishing pad 76 mounted on a spindle 70, the polishing pad having an opening 761 in the center of a polishing surface 76a for polishing a wafer; and means 6 for supplying slurry to the polishing surface of the polishing pad 76. The device further comprises means 8 that closes an upper end of a through-passage 78 passing through the rotation axes of the polishing pad 76 and the spindle 70 and supplies air into the through-passage 78. By bringing a wafer upper surface held by the holding table 3 and the polishing surface of the polishing pad 76 into contact with each other, air supplied by air supply means 8 is jetted into the opening 761 of the polishing pad 76 covered with the wafer. Slurry is spread over the entire polishing surface by radial air flows moving toward an outer circumference from the opening 761 in the direction of the polishing surface and the wafer is polished.SELECTED DRAWING: Figure 2
Inventors:
INOUE YUKI
SUZUKI TAKAMASA
SUZUKI TAKAMASA
Application Number:
JP2018077495A
Publication Date:
October 24, 2019
Filing Date:
April 13, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B24B37/00; B24B57/02
Domestic Patent References:
| JPH10339330A | 1998-12-22 | |||
| JP2003220554A | 2003-08-05 | |||
| JP2018027593A | 2018-02-22 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office