Title:
MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2019193013
Kind Code:
A
Abstract:
To reduce damage when a tray and an electronic component are taken out.SOLUTION: A method of manufacturing a crystal oscillator 1 including a lid member 20, a base member 30, and a bonding material 40 for bonding the lid member 20 and the base member 30 includes: inserting the lid member 20, the base member 30, and the bonding material 40 arranged between the lid member 20 and the base member 30 in a recess portion 110a of a tray 110 having a coefficient of thermal expansion larger than that of the lid member 20 and the base member 30; applying pressure on the lid member 20 and the base member 30 in a manner such that the lid member 20 presses the base member 30 and heating the tray 110 at a temperature of a melting point or higher of the bonding material 40; and taking out the lid member 20, the base member 30, and the bonding material 40 from the recess portion 110a during which the temperature of the tray 110 is not less than a temperature lower than the melting point of the bonding material 40 by 100°C and not more than the melting point of the bonding material 40.SELECTED DRAWING: Figure 4
Inventors:
MIZUGUCHI TAKASHI
Application Number:
JP2018081605A
Publication Date:
October 31, 2019
Filing Date:
April 20, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H03H3/02; H01L23/02
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Mutsumi Sato
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Mutsumi Sato