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Title:
POWER CONVERSION DEVICE
Document Type and Number:
Japanese Patent JP2019193466
Kind Code:
A
Abstract:
To increase heat dissipation while increasing circuit density in a power conversion device.SOLUTION: A power conversion device 10 includes: a first power conversion circuit board 20 on which a first heat generating component 25 is mounted; a second power conversion circuit board 30 on which a second heat generating component 35 is mounted; a first heat dissipating member 40A that is superimposed on the first power conversion circuit board 20 and dissipates heat of the first power conversion circuit board 20; and a second heat dissipating member 40B that is superimposed on the second power conversion circuit board 30 and dissipates the heat of the second power conversion circuit board 30, in which the first power conversion circuit board 20 and the second power conversion circuit board 30 are disposed to face each other in a direction in which the first heat radiating member 40A and the second heat radiating member 40B are arranged on the outer surface side.SELECTED DRAWING: Figure 2

Inventors:
TANAKA YASUSHI
KITA YUKINORI
Application Number:
JP2018085236A
Publication Date:
October 31, 2019
Filing Date:
April 26, 2018
Export Citation:
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Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO KK
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H02M3/00
Domestic Patent References:
JP2015095938A2015-05-18
JP2007006635A2007-01-11
JP2013201233A2013-10-03
JP2008061474A2008-03-13
JPH10295087A1998-11-04
JP2011182628A2011-09-15
JPH06245542A1994-09-02
Attorney, Agent or Firm:
Akatsuki Joint Patent Office