Title:
COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2019207920
Kind Code:
A
Abstract:
To provide a component mounting method capable of easily securing a high position accuracy to a substrate of a mounted component.SOLUTION: A component mounting method mounting an electronic component 8 to a substrate 7, contains: a correction amount specification step (step S201) of specifying a correction amount which is corresponded to a thickness difference which is a difference of a thickness of both end parts of a X-axial direction in the substrate 7; a correction step (step S203) of correcting a component mounting position to be predetermined of the electronic component 8 in the substrate 7 in accordance with the specified correction amount; and a crimping step (step S204) of crimping the electronic component 8 to the component mounting position to be corrected of the substrate 7 with a crimping tool 46.SELECTED DRAWING: Figure 13
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Inventors:
UCHIYAMA HIROSHI
OKADA YASUHIRO
YOKOMAE TAKAHIRO
TAKAKURA YUICHI
OKADA YASUHIRO
YOKOMAE TAKAHIRO
TAKAKURA YUICHI
Application Number:
JP2018101635A
Publication Date:
December 05, 2019
Filing Date:
May 28, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K13/04; H01L21/603
Domestic Patent References:
| JP2003289199A | 2003-10-10 | |||
| JP2014030007A | 2014-02-13 | |||
| JP2012033829A | 2012-02-16 | |||
| JP2003075115A | 2003-03-12 |
Attorney, Agent or Firm:
Hiromori Arai
Eisaku Teratani
Shinichi Michisaka
Eisaku Teratani
Shinichi Michisaka