Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2019207922
Kind Code:
A
Abstract:
To provide a semiconductor device that is able to improve connectivity with outside while reducing inductance.SOLUTION: A semiconductor device 10 comprises: IGBT 30A, 30B; heat sinks 40C, 40E arranged with the IGBT 30A, 30B sandwiched between them; a sealing resin body 20; and main terminals 60C, 60E connected to the heat sinks 40C, 40E and extended to outside of the sealing resin body 20. The main terminals 60C, 60E are arranged as projecting parts 61 from the sealing resin body 20 such that magnetic fluxes, generated when a main current flows, are nullified with each other. The main terminals have: counter parts 62, which are portions where respective plate surfaces of the main terminals 60C, 60E are separate from and counter to each other; and non-counter parts 63C, 63E, which are portions where the respective plate surfaces of the main terminals 60C, 60E are not counter to each other.SELECTED DRAWING: Figure 5
Inventors:
ISHINO HIROSHI
Application Number:
JP2018101717A
Publication Date:
December 05, 2019
Filing Date:
May 28, 2018
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/48; H01L23/29; H01L25/07; H01L25/18
Domestic Patent References:
| JP2016100479A | 2016-05-30 | |||
| JP2018041769A | 2018-03-15 |
Foreign References:
| WO2015136968A1 | 2015-09-17 | |||
| WO2015121900A1 | 2015-08-20 |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo