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Title:
TAPE ADHESION DEVICE
Document Type and Number:
Japanese Patent JP2019212780
Kind Code:
A
Abstract:
To provide a tape adhesion device capable of accurately performing a positioning of an adhesion tape and a workpiece.SOLUTION: A tape adhesion device adheres an adhesion tape that comprises: a non-adhesion region not having an adhesion layer on a substrate on a front surface of a plate-like workpiece having a device provided on a region divided with a lattice scheduled division line or an electrode connected with the device on the front surface, and an outer peripheral residual region surrounding the device region; and an adhesion region surrounding the non-adhesion region and having the adhesion layer on the substrate. The tape adhesion device comprises: a boundary position detection unit that detects a boundary position of the non-adhesion region of the adhesion tape and the adhesion region; and an adhesion unit for adhering the adhesion tape to the workpiece so that the non-adhesion region is overlapped to the device region and the adhesion region is overlapped to the outer peripheral residual region on the basis of the boundary position detected by the boundary position detection unit.SELECTED DRAWING: Figure 1

Inventors:
KOBAYASHI MAKOTO
KAKINUMA YOSHINORI
Application Number:
JP2018108246A
Publication Date:
December 12, 2019
Filing Date:
June 06, 2018
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683
Domestic Patent References:
JP2013243290A2013-12-05
JP2013235940A2013-11-21
JP2013247279A2013-12-09
JP2016154190A2016-08-25
JP2009246195A2009-10-22
Foreign References:
WO2016063917A12016-04-28
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro