Title:
DUAL CUP ENCLOSURE FOR ELECTRONIC DEVICES
Document Type and Number:
Japanese Patent JP2019212885
Kind Code:
A
Abstract:
To provide a plastic enclosure that has an aesthetically pleasing and uniform interface where components are joined together, houses one or more electronic assemblies, and includes weld joints that are not visible from the exterior.SOLUTION: An enclosure 105 for an electronic device comprises a housing 115 including walls (a bottom wall 205 and a sidewall 225) defining a cavity 237 configured to house an AC-DC electronic assembly. The walls include a tongue 235 formed at a distal end portion 230. A cover 110 includes: a top wall 260 forming a chamber 270; and an outer wall 265 extending from the top wall. The housing 115 is partially housed in the chamber 270, and the tongue 235 of the housing 115 is welded to a groove located in the chamber 270. Burrs from welding are housed in the enclosure so that no burr can be seen on an exterior surface of the enclosure.SELECTED DRAWING: Figure 2
Inventors:
PETER A DVORAK
JOSHUA K ANDERSON
MICHAEL A FOOTE
CHRISTOPHER J PAWLOWSKI
ROSS C HEYMAN
JOSHUA K ANDERSON
MICHAEL A FOOTE
CHRISTOPHER J PAWLOWSKI
ROSS C HEYMAN
Application Number:
JP2018183074A
Publication Date:
December 12, 2019
Filing Date:
September 28, 2018
Export Citation:
Assignee:
APPLE INC
International Classes:
H05K5/03; H01R13/504; H01R13/66; H01R31/02; H01R43/00
Foreign References:
| WO2007116791A1 | 2007-10-18 | |||
| WO2011096159A1 | 2011-08-11 |
Attorney, Agent or Firm:
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu