Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2019212887
Kind Code:
A
Abstract:
To provide a semiconductor package capable of optimizing the mounting space of a semiconductor chip and a passive component, while realizing an EMI shield structure easily.SOLUTION: A semiconductor package comprises: a support member including a resin body having first and second faces located oppositely from each other, and having a cavity penetrating the first and second faces, and a passive component embedded in the resin body and having a connection terminal exposed to the first face; a first coupling member having a first isolating layer placed on the first face of the resin body, and a first re-wiring layer placed on the first isolating layer and coupled with the connection terminal; a second coupling member including a second isolating layer placed on the first coupling member so as to cover one face of the cavity, and a second re-wiring layer placed on the second isolating layer and coupled with the first re-wiring layer; a semiconductor chip placed on the second coupling member in the cavity, and having a connection pad coupled with the second re-wiring layer; and an encapsulation material encapsulating the semiconductor chip located in the cavity, and covering the second face of the resin body.SELECTED DRAWING: Figure 9
Inventors:
KANG MYUNG SAM
KIM JIN SU
PARK YONG JIN
KO YOUNG GWAN
SEOL YONG JIN
KIM JIN SU
PARK YONG JIN
KO YOUNG GWAN
SEOL YONG JIN
Application Number:
JP2018185459A
Publication Date:
December 12, 2019
Filing Date:
September 28, 2018
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
H01L23/12; H01L23/00; H01L23/28; H01L25/00
Domestic Patent References:
| JP2015115558A | 2015-06-22 | |||
| JP2014072279A | 2014-04-21 | |||
| JP2012039090A | 2012-02-23 | |||
| JP2016219798A | 2016-12-22 | |||
| JP2016219535A | 2016-12-22 |
Foreign References:
| KR20180058095A | 2018-05-31 | |||
| US20180114758A1 | 2018-04-26 | |||
| KR20180012187A | 2018-02-05 | |||
| KR20170121671A | 2017-11-02 | |||
| KR20180029822A | 2018-03-21 | |||
| KR20180020849A | 2018-02-28 | |||
| US20150348936A1 | 2015-12-03 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki