Title:
CONDUCTIVE PASTE AND STRETCHABLE WIRING BOARD
Document Type and Number:
Japanese Patent JP2020031063
Kind Code:
A
Abstract:
To provide a conductive paste capable of achieving a conductive resin film excellent in conductive stability.SOLUTION: The conductive paste of the present invention contains an elastomer composition, a conductive filler, and a solvent and is used for forming wiring constituting a stretchable wiring board. The conductive filler contains a scale-like metal powder (G) having a tap density of 2.80 g/cmor more and 4.50 g/cmor less and an average particle diameter Dof 2.30 μm or more and 14.0 μm or less.SELECTED DRAWING: Figure 1
Inventors:
OTANI MARIKO
HAYAKAWA SHUN
HORIMOTO AKIHIRO
HAYAKAWA SHUN
HORIMOTO AKIHIRO
Application Number:
JP2019197333A
Publication Date:
February 27, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H01B1/22; H01B5/14; H05K1/09
Domestic Patent References:
| JP2007173226A | 2007-07-05 | |||
| JP2004221006A | 2004-08-05 | |||
| JP2017012674A | 2017-01-19 |
Foreign References:
| WO2018128121A1 | 2018-07-12 |
Attorney, Agent or Firm:
Shinji Hayami