Title:
WATER CUTOFF METHOD FOR WIRE BUNDLE
Document Type and Number:
Japanese Patent JP2020036472
Kind Code:
A
Abstract:
To provide a water cutoff method for a wire bundle, which has excellent cut-off performance for a wire bundle, can improve productivity by reducing a time required for a cut-off process.SOLUTION: A water cutoff method for a wire bundle is for a wire bundle formed by a plurality of conductors and a bundle of a plurality of insulation wires having an insulation layer that coats these conductors, and comprises: a peeling step of peeling the insulation layer in an end region containing one end of the wire bundle; a coating step of coating polyamide or ethylene-vinylacetate copolymer at an exposed portion of each conductor after the peeling in the peeling step; a thermal compression step of performing a thermal compression of the conductors in the exposed portion after the coating step by resistance welding; a coating step of coating the exposed portion immediately after the thermal compression step with a thermal contraction cap; and a thermal contraction step of making the thermal contraction cap thermally contract after the coating step.SELECTED DRAWING: None
Inventors:
FUKUMOTO RYOTA
AOI ISATO
YABE YUKI
AOI ISATO
YABE YUKI
Application Number:
JP2018161886A
Publication Date:
March 05, 2020
Filing Date:
August 30, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELECTRIC FINE POLYMER INC
SUMITOMO ELECTRIC FINE POLYMER INC
International Classes:
H02G1/14; H01B7/00; H01B7/285; H01B13/00; H01B13/32; H02G15/04
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kenichi Fujinaka
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kenichi Fujinaka