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Patent Searching and Data


Title:
HEAT SHRINKABLE FILM AND SEALED PACKAGE
Document Type and Number:
Japanese Patent JP2020037431
Kind Code:
A
Abstract:
To provide a heat shrinkable film which can inhibit film cutting in a production process and can give a sealed package having tension and easy-opening, and the sealed package.SOLUTION: In a heat shrinkable film including vinylidene chloride resin, each of heat shrinkage ratios of TD and MD at 120°C is 25%-40% independently, a scar line where scars that penetrate the heat shrinkable film are arranged in the longitudinal direction consists of at least one line in a side end portion that is a region of 1.0 mm-5.0 mm from an end of the heat shrinkable film, and a gap of the longitudinal direction of the scars is 4 mm-30 mm.SELECTED DRAWING: None

Inventors:
SHIBA MASAKUNI
SHIBATA SATOMI
Application Number:
JP2018165386A
Publication Date:
March 12, 2020
Filing Date:
September 04, 2018
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
B65D65/02; B65D75/20; B65D81/24
Domestic Patent References:
JP2013126891A2013-06-27
JP2014046987A2014-03-17
JPH0213343A1990-01-17
JPS6312471A1988-01-19
Foreign References:
US4940614A1990-07-10
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito