Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2020038943
Kind Code:
A
Abstract:
To provide a semiconductor device capable of performing protection and reinforcement of connection terminals formed on semiconductor chips by underfill resin and allowed to be miniaturized, and to provide a manufacturing method of the semiconductor device.SOLUTION: According to one embodiment of the invention, a semiconductor device has a plurality of semiconductor chips on which a plurality of connection terminals are respectively formed. In the semiconductor device, the plurality of semiconductor chips are mounted on the first surface of a mounting board by the plurality of connection terminals. A frame section is continuously formed on the first surface of the mounting board and surrounds the circumference of the plurality of semiconductor chips. A filler is filled in the frame section. A plurality of connection terminals are formed on the second surface of the mounting board which is opposed to the first surface.SELECTED DRAWING: Figure 1
Inventors:
WATABE KAZUHIRO
Application Number:
JP2018166347A
Publication Date:
March 12, 2020
Filing Date:
September 05, 2018
Export Citation:
Assignee:
TOSHIBA CORP
TOSHIBA ELECTRONIC DEVICES & STORAGE CORP
TOSHIBA ELECTRONIC DEVICES & STORAGE CORP
International Classes:
H01L23/28; H01L21/56; H01L21/60; H01L23/12; H01L25/00
Attorney, Agent or Firm:
Sakai International Patent Office