Title:
ELECTROWETTING DEVICE
Document Type and Number:
Japanese Patent JP2020042261
Kind Code:
A
Abstract:
To provide an electrowetting device which includes a dielectric layer excellent in breakdown voltage and can be driven at a low voltage.SOLUTION: An electrowetting device 100 includes a first substrate 11, a plurality of first electrodes 14 formed on the first substrate, a dielectric layer 16 formed on the plurality of first electrodes, a first water-repellent layer 18 formed on the dielectric layer, a second substrate 21, a second electrode 24 formed on the second substrate, and a second water-repellent layer 28 formed on the second electrode. The first substrate and the second substrate are arranged with a gap between the first water-repellent layer and the second water-repellent layer. The first electrode 14 includes an indium oxide-zinc oxide layer, the dielectric layer 16 includes a silicon nitride layer, and the silicon nitride layer is formed directly on the indium oxide-zinc oxide layer.SELECTED DRAWING: Figure 2
Inventors:
TATENO CHIHIRO
TSUJINO KAZUYA
HACHIYA ATSUSHI
TSUJINO KAZUYA
HACHIYA ATSUSHI
Application Number:
JP2019160708A
Publication Date:
March 19, 2020
Filing Date:
September 03, 2019
Export Citation:
Assignee:
SHARP KK
International Classes:
G02F1/17
Attorney, Agent or Firm:
Seiji Okuda
Osamu Kita
Ryoji Yamashita
Akiko Miyake
Hidetaka Okabe
Yu Tanaka
Murase Nariyasu
Rinko Kita
Osamu Kita
Ryoji Yamashita
Akiko Miyake
Hidetaka Okabe
Yu Tanaka
Murase Nariyasu
Rinko Kita