Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2020050797
Kind Code:
A
Abstract:
To provide a resin composition capable of forming a cured product having good surface appearance and high adhesion to a substrate.SOLUTION: The resin composition contains (A) an epoxy resin, (B) a curing agent, (C) a phenoxy resin having a weight average molecular weight within the range of 30,000 or more and 100,000 or less, (D) a surface conditioner, and (E) a defoaming agent. The surface conditioner (D) contains a polyether-modified polydimethylsiloxane. The defoaming agent (E) contains an acrylic copolymer.SELECTED DRAWING: Figure 1
Inventors:
OTSUKA MANABU
YAMAUCHI AKIHIRO
SHINPO TAKASHI
FUJISAWA HIROYUKI
NAKAMURA YOSHIHIKO
YAMAUCHI AKIHIRO
SHINPO TAKASHI
FUJISAWA HIROYUKI
NAKAMURA YOSHIHIKO
Application Number:
JP2018182929A
Publication Date:
April 02, 2020
Filing Date:
September 27, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C08L63/00; B32B27/38; C08G59/40; C08J5/24; C08L33/04; C08L71/10; C08L83/12; H05K1/03; H05K3/46
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office