Title:
MULTI-CHIP PACKAGE
Document Type and Number:
Japanese Patent JP2020068296
Kind Code:
A
Abstract:
To improve the performance of data transfer across a plurality of boards in a multi-chip package in which the boards are attached to a base board.SOLUTION: A multi-chip package 2 includes a base substrate 20 in which a first substrate 21 and a second substrate 22 are adjacent to each other, and that is attached to the mounting surface side, a first substrate 21 on which a first signal input/output unit 210 capable of inputting or outputting an electric signal 200 is formed on the surface adjacent to a second substrate 22 from among a plurality of surfaces forming the outer shape of the first substrate 21, the second substrate 22 on which a second signal input/output unit 220 capable of inputting or outputting the electric signal 200 is formed on the surface adjacent to the first substrate 21 from among a plurality of surfaces forming the outer shape of the second substrate 22, and a connection unit 23 that connects the first signal input/output unit 210 and the second signal input/output unit 220 such that the electric signal 200 can be transmitted without passing through the base substrate 20.SELECTED DRAWING: Figure 4
Inventors:
NEDACHI TAKAAKI
Application Number:
JP2018200222A
Publication Date:
April 30, 2020
Filing Date:
October 24, 2018
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L25/04; H01L23/32; H01L23/52; H01L25/18
Domestic Patent References:
| JP2001185648A | 2001-07-06 |
Foreign References:
| WO2017064791A1 | 2017-04-20 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka