Title:
BUILDING COOLING AND HEATING SYSTEM
Document Type and Number:
Japanese Patent JP2020070950
Kind Code:
A
Abstract:
To enable a water-cooled multiple packaged air conditioner to be installed in a building in a certain area subject to area-wide air conditioning.SOLUTION: A building 10 into which a building cooling and heating system is introduced has: a water-cooled multiple packaged air conditioner 11; a heat exchanger 12a which performs heat exchange between cold water (circulated water) for DHC sent from another building located in a certain area subject to area-wide air conditioning and heat source water of the water-cooled multiple packaged air conditioner 11; a heat exchanger 12b which performs heat exchange between hot water (circulated water) for DHC sent from another building and the heat source water of the water-cooled multiple packaged air conditioner 11; and a controller 18 which closes a hot water valve 13b and controls an opening of a cold water valve 13a, when a cooling load is larger than a heating load in the building 10, so that a temperature of the heat source water supplied to a heat source unit 111 becomes not less than 10 degrees and closes the cold water valve 13a and controls the opening of the hot water valve 13b, when the heating load is larger than the cooling load, so that the temperature of the heat source water supplied to the heat source unit 111 becomes not more than 45 degrees.SELECTED DRAWING: Figure 2
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Inventors:
ODANE MASAHIRO
Application Number:
JP2018203952A
Publication Date:
May 07, 2020
Filing Date:
October 30, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC BUILDING TECHNO SERVICE CO LTD
International Classes:
F24F3/08; F24F11/30
Domestic Patent References:
| JPH01169250A | 1989-07-04 | |||
| JPH062891A | 1994-01-11 | |||
| JP2005069552A | 2005-03-17 | |||
| JPH0554921U | 1993-07-23 | |||
| JP2005140367A | 2005-06-02 | |||
| JP2001215037A | 2001-08-10 |
Foreign References:
| US20120193066A1 | 2012-08-02 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office