SWITCH MODULE AND SWITCH DEVICE

Title:

SWITCH MODULE AND SWITCH DEVICE

Document Type and Number:

Japanese Patent JP2020071991

Kind Code:

A

Abstract:

To provide a switch module and a switch device that enable good operation with a configuration that does not use solder.SOLUTION: A switch module includes a housing having a housing portion penetrating in a thickness direction between a first surface and a second surface, and fixed to a substrate having a fixed contact member, a movable contact member that is housed in the housing portion and is capable of coming into contact with and separating from the fixed contact member, and a cover sheet fixed to the first surface of the housing, and the housing includes a surrounding portion that is formed to project from the second surface, surrounds the housing portion in plan view, and has elasticity.SELECTED DRAWING: Figure 6

Inventors:

SATO HIDETAKA

Application Number:

JP2018205095A

Publication Date:

May 07, 2020

Filing Date:

October 31, 2018

Export Citation:

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