Title:
THERMOSETTING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020073694
Kind Code:
A
Abstract:
To provide a thermosetting adhesive sheet which reduces warpage of a semiconductor wafer and can reduce occurrence of chipping, and to provide a method for manufacturing a semiconductor device.SOLUTION: There is provided a thermosetting adhesive sheet which has a thermosetting adhesive layer that contains a resin component containing (meth)acrylate and a polymerization initiator, and a filler, where the (meth)acrylate contains solid (meth)acrylate and tri- or higher-functional (meth)acrylate, a content of the solid (meth)acrylate in the resin component is 55 wt.% or more, the total sum of a value obtained by multiplying a content of the (meth)acrylate in the resin component by the number of functional groups per unit molecular weight of the (meth)acrylate is 2.7E-03 or more, and an amount of the filler to be blended is 80-220 pts.mass with respect to 100 pts.mass of the resin component.SELECTED DRAWING: Figure 1
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Inventors:
MORI DAICHI
ISHIMATSU TOMOYUKI
ISHIMATSU TOMOYUKI
Application Number:
JP2020007736A
Publication Date:
May 14, 2020
Filing Date:
January 21, 2020
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
C09J7/35; C09J4/02; C09J11/04; C09J11/06; H01L21/301; H01L21/683
Domestic Patent References:
| JP2010223992A | 2010-10-07 | |||
| JP2013216804A | 2013-10-24 | |||
| JP2010261026A | 2010-11-18 | |||
| JP2000008021A | 2000-01-11 |
Foreign References:
| WO2014148642A1 | 2014-09-25 |
Attorney, Agent or Firm:
Nobuhiro Noguchi