Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020077762
Kind Code:
A
Abstract:
To provide a semiconductor device capable of improving reliability of junction between a support layer and a wiring layer.SOLUTION: A semiconductor device comprises: a support layer 10 that has a support surface 10A and a bottom surface 10B, directed to the sides opposite to each other in a thickness direction z; a wiring layer 20 that is joined to the support surface 10A; and a semiconductor element 40 that is electrically joined to the wiring layer 20 on the other side of the support layer 10 with respect to the wiring layer 20. The support layer 10 has a base layer 11 that includes the support surface 10A, and an insulation layer 12 that includes the bottom surface 10B and that is connected to the base layer 11. An element of a constituent material of the base material 11 includes silicon, and a constituent material of the insulation layer 12 includes silicon dioxide.SELECTED DRAWING: Figure 12
Inventors:
KANDA SOUZU
Application Number:
JP2018210198A
Publication Date:
May 21, 2020
Filing Date:
November 08, 2018
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L23/36; H01L21/60; H01L23/28; H01L23/48
Attorney, Agent or Firm:
Minoru Yoshida
Nao Usui
Nao Usui