Title:
SEMICONDUCTOR SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2020077764
Kind Code:
A
Abstract:
To provide a semiconductor sensor device in which secure connection between a wiring structure and a signal line can be achieved and which has improved reliability as result of the secure connection, a manufacturing method of the semiconductor sensor device.SOLUTION: The semiconductor sensor device is provided in which a plurality of signal lines and a sensor detection unit are arranged, the semiconductor sensor device comprises: a conductive film that is arranged on a board, constitutes a signal line, and has a top surface exposed via an opening having a width smaller than that of the signal line; a conductive member that is formed on the conductive film and is electrically connected to the conductive film via the opening; and a wiring structure that is formed on a top surface of the conductive member and has an air bridge structure establishing connection between signal lines or between the signal line and the sensor detection unit. The conductive member has a top surface in contact with the wiring structure and an exposed side surface.SELECTED DRAWING: Figure 1B
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Inventors:
INOUE HIROMOTO
HOSOMI SHINICHI
KAWAMA YOSHITATSU
SUGINO TAKAKI
HOSOMI SHINICHI
KAWAMA YOSHITATSU
SUGINO TAKAKI
Application Number:
JP2018210256A
Publication Date:
May 21, 2020
Filing Date:
November 08, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L27/144
Domestic Patent References:
| JP2000146686A | 2000-05-26 | |||
| JPH03255631A | 1991-11-14 | |||
| JP2012149893A | 2012-08-09 | |||
| JP2011214857A | 2011-10-27 | |||
| JP2009192350A | 2009-08-27 | |||
| JP2006086535A | 2006-03-30 |
Foreign References:
| WO2018110309A1 | 2018-06-21 |
Attorney, Agent or Firm:
Patent Business Corporation Parumo Patent Office
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa