Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2020080350
Kind Code:
A
Abstract:
To provide a substrate processing apparatus capable of suppressing contamination of the lower surface of a substrate during freeze cleaning.SOLUTION: A substrate processing apparatus according to an embodiment includes a nozzle, a support portion, a treatment liquid supply portion, a first medium supply portion, and a second medium supply portion. The nozzle is arranged to face the first surface of the substrate. The support portion is arranged between the first surface and the nozzle and supports the substrate at a predetermined distance from the nozzle. The processing liquid supply portion supplies a processing liquid to the second surface of the substrate that faces the first surface. The first medium supply portion supplies a first medium from a first supply port provided in the nozzle to a space between the nozzle and the first surface of the substrate. The second medium supply portion supplies a second medium having a temperature higher than that of the first medium to the space from a second supply port provided at a peripheral portion of the nozzle.SELECTED DRAWING: Figure 1
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Inventors:
TAKAI KOSUKE
Application Number:
JP2018212198A
Publication Date:
May 28, 2020
Filing Date:
November 12, 2018
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
H01L21/304; G03F1/82; H01L21/027
Domestic Patent References:
| JP2010199261A | 2010-09-09 | |||
| JP2014179490A | 2014-09-25 |
Foreign References:
| US20170153550A1 | 2017-06-01 |
Attorney, Agent or Firm:
Sakai International Patent Office