Title:
BARRIER STRUCTURE FOR CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2020088206
Kind Code:
A
Abstract:
To provide a highly reliable barrier structure for a circuit board.SOLUTION: A barrier structure for a circuit board includes a circuit board 3, a first electrical component 4 provided on a surface 3a of the circuit board 3, and a barrier 2 covering the surface 3a of the circuit board 3 and the first electrical component 4. The barrier 2 includes a first component barrier portion 2a that covers a surface 4a of the first electrical component 4 and a substrate barrier portion 2b that covers the surface 3a of the circuit board 3. A distance A from the inner surface of the first component barrier portion 2a to the surface 3a of the circuit board 3 is larger than a distance B from the inner surface of the substrate barrier portion 2b to the surface 3a of the circuit board 3. The inner surface of the first component barrier portion 2a is separated from the surface 4a of the first electrical component 4 by a preset distance.SELECTED DRAWING: Figure 1
Inventors:
MORI YUMA
ITO KENICHI
ITO KENICHI
Application Number:
JP2018221613A
Publication Date:
June 04, 2020
Filing Date:
November 27, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/28; H05K5/02; H05K5/03
Domestic Patent References:
| JP2018037540A | 2018-03-08 | |||
| JP2007027416A | 2007-02-01 | |||
| JPS60241237A | 1985-11-30 | |||
| JPH0595091U | 1993-12-24 | |||
| JP2014165298A | 2014-09-08 |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Jiro Ozawa
Hideki Takahashi
Jiro Ozawa