Title:
PANEL COOLING STRUCTURE
Document Type and Number:
Japanese Patent JP2020108191
Kind Code:
A
Abstract:
To provide a panel cooling structure that can contribute to the cooling performance, downsizing, etc. of a panel.SOLUTION: A panel cooling structure comprises: a box-shaped peripheral wall 2 that forms a panel space part 11; a partition wall 3 that is mounted on the central part side of a panel standing direction (z direction) in the panel space part 11, and that extends in a panel horizontal direction (xy directions); and a heat exchanger 4 that is arranged on the peripheral wall 2 opposite to the partition wall 3. The partition wall 3 is formed with a through portion 31 in either direction of the residual two directions (y direction) of the four panel horizontal directions except for the heat exchanger side relative direction (x direction). In the heat exchanger 4, both openings of an air inlet port 41 and an air outlet port 43 are situated deviated toward an opposite side direction to the through portion 31, and both of them are situated apart having a predetermined distance in the panel standing direction with the partition wall 3 as a boundary. One of both openings is open to a ceiling wall 21 side in the panel space part 11, and the other of both openings is open to a bottom wall 22 side in the panel space part 11.SELECTED DRAWING: Figure 2
Inventors:
YAMADA YOHEI
Application Number:
JP2018242295A
Publication Date:
July 09, 2020
Filing Date:
December 26, 2018
Export Citation:
Assignee:
MEIDENSHA ELECTRIC MFG CO LTD
International Classes:
H02M7/48; H05K7/20
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Uzawa Hidehisa
Tomoyuki Ota
Tomioka Kiyoshi
Uzawa Hidehisa
Tomoyuki Ota