Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FILM, METAL-CLAD LAMINATE, FLEXIBLE SUBSTRATE, FILM PRODUCTION METHOD, METAL-CLAD LAMINATE PRODUCTION METHOD, AND FLEXIBLE SUBSTRATE PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2020110972
Kind Code:
A
Abstract:
To provide a polyimide film that has a high structural symmetry and an excellent dimensional stability, and to provide a metal-clad laminate.SOLUTION: Provided is a film, including a substrate layer 14 made of a polyimide for substrate obtained from pyromellitic dianhydride and m-tolidine, a first adhesive layer 12 formed on one surface of the substrate layer 14 and made of a first thermoplastic polyimide, and a second adhesive layer 16 formed on the other surface of the substrate layer and made of a second thermoplastic polyimide, and in which the maximum height roughness of a first interface between the substrate layer 14 and the first adhesive layer 12 and the maximum height roughness of a second interface between the substrate layer 14 and the second adhesive layer 16 are 1.0 μm or less.SELECTED DRAWING: Figure 1

Inventors:
SHIRONO TAKAFUMI
PARK SOONYONG
PARK YOUNGSEOK
Application Number:
JP2019003369A
Publication Date:
July 27, 2020
Filing Date:
January 11, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG CHEMICAL LTD
International Classes:
B32B27/34; B32B15/08; B32B27/00; H05K1/03; H05K3/00
Domestic Patent References:
JP2011149067A2011-08-04
JP2017200759A2017-11-09
JP2018145303A2018-09-20
JP2016193543A2016-11-17
JP2017144730A2017-08-24
JP2008087254A2008-04-17
JP2017179149A2017-10-05
Foreign References:
WO2008004496A12008-01-10
WO2012133594A12012-10-04
WO2006107043A12006-10-12
WO2016013627A12016-01-28
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe