Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2020118949
Kind Code:
A
Abstract:
To provide a negative photosensitive resin composition allowing for formation of a pattern which has excellent resolution when a photolithography method is applied thereto, and in which occurrence of undercut is suppressed, a resin film that is a cured product of the negative photosensitive resin composition, and an electronic device including the resin film.SOLUTION: The negative photosensitive resin composition is provided that includes an epoxy resin, a polymer including norbornene and its derivative and a structural unit represented by a maleic acid derivative, a photoacid generator.SELECTED DRAWING: None
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Inventors:
MITSUI YASUAKI
TAKAHASHI YASUNORI
TAKAHASHI YASUNORI
Application Number:
JP2019100945A
Publication Date:
August 06, 2020
Filing Date:
May 30, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/038; C08G59/40; C08L45/00; C08L63/00; G03F7/004
Attorney, Agent or Firm:
Shinji Hayami