COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND THERMALLY CONDUCTIVE MATERIAL

Title:

COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND THERMALLY CONDUCTIVE MATERIAL

Document Type and Number:

Japanese Patent JP2020122070

Kind Code:

A

Abstract:

To provide: a composition for forming a thermally conductive material capable of providing the thermally conductive material having excellent thermal conductivity; and a thermally conductive material formed by the composition for forming the thermally conductive material.SOLUTION: A composition for forming a thermally conductive material includes a specific alicyclic epoxy compound, thermally conductive inorganic particles and a cationic polymerization initiator.SELECTED DRAWING: None

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Inventors:

HASEGAWA KAZUHIRO
KITAGAWA HIROTAKA

Application Number:

JP2019014207A

Publication Date:

August 13, 2020

Filing Date:

January 30, 2019

Export Citation:

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Assignee:

FUJIFILM CORP

International Classes:

C08L63/00; C08G59/24; C08G59/68; C08K3/01; C08K3/28; C08K3/34; C08K3/38

Attorney, Agent or Firm:

Hideaki Ito
Fumio Mitsuhashi

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