Title:
ADHESIVE COMPOSITION AND ADHESIVE PRODUCT FOR ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2020125386
Kind Code:
A
Abstract:
To provide an adhesive composition and adhesive product for an electrochemical device having improved solvent resistance while having initial adhesion, and an electrochemical device including the same.SOLUTION: An adhesive composition for an electrochemical device has a (meth) acrylate containing an alkyl group having 8 or more carbon atoms, and a (meth) acrylic polymer obtained by the copolymerization of a monomer component containing a crosslinkable monomer and a nitrogen heterocycle-containing monomer.SELECTED DRAWING: None
Inventors:
NODA NOBUHISA
Application Number:
JP2019017287A
Publication Date:
August 20, 2020
Filing Date:
February 01, 2019
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C09J133/06; C09J7/38; C09J139/04; C09J139/06; C09J175/04; H01G9/048; H01G9/08; H01M4/62
Domestic Patent References:
| JP2017152372A | 2017-08-31 | |||
| JP2015040215A | 2015-03-02 | |||
| JP2013064079A | 2013-04-11 | |||
| JP2012226992A | 2012-11-15 |
Foreign References:
| WO2013080792A1 | 2013-06-06 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark