Title:
POLYIMIDE FILM HAVING VOID, AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2020128522
Kind Code:
A
Abstract:
To provide a polyimide film, that has a low residual stress generated between the glass substrate and the inorganic film, has an excellent adhesion to glass substrate and preferably has a high transparency, can be peeled off satisfactorily even when the irradiation energy in the laser peeling process is low, and does not cause charring or particle generation.SOLUTION: Provided is a polyimide film, having a void of 100 nm or less and used as a substrate for flexible device, and in which the porosity of the polyimide film is 4.2 vol.% or more and 11.6 vol.% or less.SELECTED DRAWING: Figure 1
Inventors:
MIYAMOTO YOSHIKI
IIZUKA YASUSHI
KATO SATOSHI
KANEDA TAKAYUKI
IIZUKA YASUSHI
KATO SATOSHI
KANEDA TAKAYUKI
Application Number:
JP2019199048A
Publication Date:
August 27, 2020
Filing Date:
October 31, 2019
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08J9/26; C08J5/18
Domestic Patent References:
| JP2013080876A | 2013-05-02 | |||
| JP2010202729A | 2010-09-16 | |||
| JP2010507829A | 2010-03-11 | |||
| JP2010202679A | 2010-09-16 |
Foreign References:
| WO2015198970A1 | 2015-12-30 | |||
| WO2013047451A1 | 2013-04-04 | |||
| WO2011122199A1 | 2011-10-06 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Hideo Katsumata
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Hideo Katsumata