Title:
COMPOSITION AND ETCHING METHOD
Document Type and Number:
Japanese Patent JP2020128574
Kind Code:
A
Abstract:
To provide a composition useful in etching of a metal layer, such as a copper based layer, which can form a fine pattern excellent in dimensional accuracy with high linearity while inhibiting generation of a residual film.SOLUTION: The composition is an aqueous solution comprising: (A) 0.1-25 mass% of at least one component selected from cupric and ferric ions; (B) 0.1-30 mass% of chloride ions; (C) 0.01-10 mass% of a compound represented by the specified general formula (1) having a number-average molecular weight of 550-1,400; (D) 0.01-10 mass% of a compound represented by the specified general formula (2); and water.SELECTED DRAWING: None
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Inventors:
ABE TETSUJI
MASAMOTO YUJI
CHIBA HIROYUKI
MASAMOTO YUJI
CHIBA HIROYUKI
Application Number:
JP2019021579A
Publication Date:
August 27, 2020
Filing Date:
February 08, 2019
Export Citation:
Assignee:
ADEKA CORP
International Classes:
C23F1/18; H05K3/06
Attorney, Agent or Firm:
Toshieko Kondo
Chongqing Sugano
Keita Takeyama
Kaoru Okada
Chongqing Sugano
Keita Takeyama
Kaoru Okada