Title:
COMPOSITE FILLER AND RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2020147474
Kind Code:
A
Abstract:
To provide a composite filler which has high conductive efficiency and can be filled with a resin while activating high thermal conductivity of aluminum nitride powder.SOLUTION: A composite filler contains, when the total of the volume of the total constituent powder is taken as 100 vol.%: 60-90 vol.% of aluminum nitride powder which is a polyhedral particle having a surface structure having at least two flat surfaces and has a cumulative 50% value (D50) in particle size distribution curve of 20-200 μm; and 10-40 vol.% of inorganic powder (B) which has thermal conductivity of 45-60 W/m K, Mohs hardness of 7 or less and a cumulative 50% value (D50) in particle size distribution curve of 2-20 μm.SELECTED DRAWING: None
More Like This:
Inventors:
KURAMOTO AKIMASA
KANECHIKA YUKIHIRO
KANECHIKA YUKIHIRO
Application Number:
JP2019048562A
Publication Date:
September 17, 2020
Filing Date:
March 15, 2019
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
C01B21/072; C08K3/01; C08K3/22; C08K3/28; C08L101/00
Domestic Patent References:
| JP2010242022A | 2010-10-28 | |||
| JP2017088696A | 2017-05-25 | |||
| JPH11307700A | 1999-11-05 |
Foreign References:
| WO2017131239A1 | 2017-08-03 | |||
| WO2014155975A1 | 2014-10-02 | |||
| WO2017145410A1 | 2017-08-31 |
Attorney, Agent or Firm:
Patent corporation ssinpat