Title:
RESIN COMPOSITION, AND WIRING MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2020164695
Kind Code:
A
Abstract:
To provide a resin composition that can form a wiring material coating layer having excellent crushing strength, yield strength and breaking elongation, and to provide a wiring material having a layer made of this resin composition as a covering layer.SOLUTION: A resin composition, which is a resin composition containing a clay mineral and a quaternary ammonium salt by 2 to 15 pts.mass in total for 100 pts.mass of a base resin, and in which the base resin contains an acid-modified polyolefin resin by 10 to 30 mass% and a polyolefin resin (X) other than the acid-modified polyolefin resin by 70 to 90 mass%; and a wiring material that has the resin composition as covering layer.SELECTED DRAWING: None
Inventors:
MIZUNO KOICHI
YAMAGUCHI MICHIO
SHIRAI TOMOYUKI
YAMAGUCHI MICHIO
SHIRAI TOMOYUKI
Application Number:
JP2019067939A
Publication Date:
October 08, 2020
Filing Date:
March 29, 2019
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C08L23/02; C08K3/34; C08K5/19; C08L23/26; C08L25/08
Domestic Patent References:
| JP2007277530A | 2007-10-25 | |||
| JP2004075811A | 2004-03-11 | |||
| JP2006265507A | 2006-10-05 | |||
| JP2002173558A | 2002-06-21 | |||
| JP2002060555A | 2002-02-26 | |||
| JP2002030181A | 2002-01-31 | |||
| JP2005060592A | 2005-03-10 | |||
| JP2016166314A | 2016-09-15 |
Other References:
水素添加剤（増粘剤・沈降防止剤・吸着剤）ＢＥＮ−ＧＥＬ 有機系添加剤（増粘剤・沈降防止剤・ナノフィラ, JPN6021028845, 14 July 2021 (2021-07-14), ISSN: 0004556473
Attorney, Agent or Firm:
Patent corporation Iida and Partners
Toshizo Iida
Ikuo Shinoda
Sachie Tanaka
Toshizo Iida
Ikuo Shinoda
Sachie Tanaka