Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2020174139
Kind Code:
A
Abstract:
To provide a wiring board with small thickness variation and to increase the yield when fine wiring is formed.SOLUTION: A wiring board consists of: an organic core material alone; a resin composition layer formed on an organic core material; or a resin composition layer alone, in which a difference between the thickness of the thickest portion and the thickness of the thinnest portion in an area of 2500 mm2 is controlled 8 μm or less by surface polishing means. It is preferable that the surface polishing means is any one or more of a chemical mechanical polishing method, a mechanical polishing method, an electrolytic polishing method, and a chemical polishing method.SELECTED DRAWING: Figure 1
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Inventors:
OTAKE SHUNSUKE
MITSUKURA KAZUYUKI
KURABUCHI KAZUHIKO
MASUKO TAKASHI
FUJITA HIROAKI
OZE MASAHISA
MITSUKURA KAZUYUKI
KURABUCHI KAZUHIKO
MASUKO TAKASHI
FUJITA HIROAKI
OZE MASAHISA
Application Number:
JP2019075529A
Publication Date:
October 22, 2020
Filing Date:
April 11, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/38; H05K3/46
Domestic Patent References:
| JP2003051567A | 2003-02-21 | |||
| JPH08153951A | 1996-06-11 | |||
| JP2015065295A | 2015-04-09 | |||
| JP2006210565A | 2006-08-10 |