Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2020181094
Kind Code:
A
Abstract:
To improve sealing performance of an electronic device having a structure for sealing a sealing object.SOLUTION: An electronic device 1 is provided, comprising a first substrate 2, a second substrate 3, a sealing object 4 sealed between the first substrate 2 and the second substrate 3, a first sealing part 5 joining the first substrate 2 and the second substrate 3, and a second sealing part 6 joining the first substrate 2 and the second substrate 3 at an outer position than the first sealing part 5. The second sealing part 6 contains glass.SELECTED DRAWING: Figure 2
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Inventors:
SHIRAGAMI TORU
Application Number:
JP2019084185A
Publication Date:
November 05, 2020
Filing Date:
April 25, 2019
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO
International Classes:
G02F1/1339
Attorney, Agent or Firm:
Kunihiko Shiromura
Tsuyoshi Kumano
Junya Yamamoto
Tsuyoshi Kumano
Junya Yamamoto