Title:
HIGH-FREQUENCY DEVICE AND MULTIPLEXER
Document Type and Number:
Japanese Patent JP2020182128
Kind Code:
A
Abstract:
To prevent reduction in loss.SOLUTION: A high-frequency device includes: a circuit board including a plurality of laminated dielectric layers and a plurality of wiring patterns provided on at least one dielectric layer of the plurality of dielectric layers; an elastic wave device that includes a first signal terminal and a first ground terminal provided on the surface of the dielectric layer at the end in the stacking direction of the plurality of dielectric layers, and a signal pad, a ground pad, and an elastic wave element connected to the signal pad and the ground pad mounted on the surface, in which the signal pad is joined to the first signal terminal and the ground pad is joined to the first ground terminal; and an inductor formed by at least one wiring pattern of the plurality of wiring patterns, in which a region surrounded by the at least one wiring pattern does not overlap with the first ground terminal in a plan view.SELECTED DRAWING: Figure 8
Inventors:
SEKINE HIDEYUKI
CHOO HOSUNG
INOUE MAKOTO
CHOO HOSUNG
INOUE MAKOTO
Application Number:
JP2019084508A
Publication Date:
November 05, 2020
Filing Date:
April 25, 2019
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H03H9/64; H03H7/46; H03H9/17; H03H9/70; H03H9/72
Domestic Patent References:
| JP2012109818A | 2012-06-07 | |||
| JPH0514102A | 1993-01-22 | |||
| JP2019009583A | 2019-01-17 | |||
| JP2001211097A | 2001-08-03 |
Foreign References:
| WO2012046481A1 | 2012-04-12 |
Attorney, Agent or Firm:
Shuhei Katayama