Title:
ELECTRONIC COMPONENT PACKAGING METHOD AND ELECTRONIC COMPONENT PACKAGING SYSTEM
Document Type and Number:
Japanese Patent JP2020191447
Kind Code:
A
Abstract:
To provide an electronic component packaging method and an electronic component packaging system, capable of reducing defective bonding by solder.SOLUTION: An electronic component packaging method for packaging an electronic component, via solder, over a land formed on a substrate includes: a detection step of detecting a formation position of lands 51a, 51b formed on a substrate 30; a solder printing step of printing solders 52a, 52b from above at the detected formation position P2; a mounting step of mounting an LED 54, on the substrate 30 on which the solders 52a, 52b are printed, from above at a design position P1, which is a position designed for the lands; and a reflow step of heating the substrate 30 on which the LED 54 is mounted to perform bonding by solder.SELECTED DRAWING: Figure 3
Inventors:
INOUE MASAFUMI
EZAKI RYOTA
KUNUGI ISAO
AITANI MAKOTO
EZAKI RYOTA
KUNUGI ISAO
AITANI MAKOTO
Application Number:
JP2020085817A
Publication Date:
November 26, 2020
Filing Date:
May 15, 2020
Export Citation:
Assignee:
SIIX CORP
International Classes:
H05K13/04; B23K1/00; H05K3/34
Domestic Patent References:
| JP2003163449A | 2003-06-06 | |||
| JP2004048044A | 2004-02-12 | |||
| JP2004039873A | 2004-02-05 | |||
| JP2018152502A | 2018-09-27 | |||
| JP2008199070A | 2008-08-28 | |||
| JP2013088699A | 2013-05-13 |
Attorney, Agent or Firm:
Eimei Yamamoto
Taiji Kasai
Kasai Sayaka
Taiji Kasai
Kasai Sayaka