Title:
HEAT CONTROLLER, COOLING SYSTEM, HEATING SYSTEM AND ELECTRONIC PRODUCT
Document Type and Number:
Japanese Patent JP2020200980
Kind Code:
A
Abstract:
To devise a layout to avoid deterioration of heat quantity transport capacity per unit mounting area of a temperature control unit (heat controller), in a case of providing a plurality of Peltier elements (Peltier effect elements).SOLUTION: A plurality of Peltier modules 11 to 16 having Peltier effect elements whose first surfaces are heat absorption surfaces 11a to 16a and second surfaces are heat dissipation surfaces 11b to 16b, is arranged along a direction orthogonal to a surface direction. Between the heat absorption surfaces 11a to 16a facing each other, heat absorption flow passages 21, 22 are arranged. Between the heat dissipation surfaces 11b to 16b facing each other, heat dissipation flow passages 31, 33 are arranged. The heat absorption flow passages 21, 22 are connected to a heat absorption flow passage connection part 40. The heat dissipation flow passages 31, 33 are connected to the heat dissipation flow passages connection part 50.SELECTED DRAWING: Figure 1
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Inventors:
EGAWA HIDENORI
HENMI AKIHIKO
HENMI AKIHIKO
Application Number:
JP2019107362A
Publication Date:
December 17, 2020
Filing Date:
June 07, 2019
Export Citation:
Assignee:
UNITED PRECISION TECH CO LTD
International Classes:
F25B21/02; F24F1/0097; F25D11/00
Attorney, Agent or Firm:
Hiroaki Yamauchi
Takeshi Yamada
Takeshi Yamada