Title:
PROCESSING METHOD OF WAFER
Document Type and Number:
Japanese Patent JP2021019146
Kind Code:
A
Abstract:
To provide a processing method of a wafer in which adhesive tape and an annular frame on an outer periphery of the wafer are prevented from being processed by a dry etching.SOLUTION: A processing method of a wafer, comprises: a frame unit preparation step of fixing the wafer to an open of an annular frame with adhesive tape to prepare a frame unit; a frame unit holding step of sucking and holding the wafer of the frame unit via the adhesive tape with an electrostatic chuck table in an etching chamber; a shielding step of covering an annular region of the annular frame and the adhesive tape with a cover member ro shield them from an outer space; and a dry etching step of supplying a gas to the etching chamber and dry-etching the wafer after the implementation of the frame unit holding step and the shielding step.SELECTED DRAWING: Figure 2
Inventors:
TAKAHASHI HIROYUKI
WADA KENTARO
WATANABE YOSHIO
YOKOO SUSUMU
WADA KENTARO
WATANABE YOSHIO
YOKOO SUSUMU
Application Number:
JP2019135257A
Publication Date:
February 15, 2021
Filing Date:
July 23, 2019
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; H01L21/3065; H01L21/683
Domestic Patent References:
| JP2018182093A | 2018-11-15 | |||
| JP2018078168A | 2018-05-17 | |||
| JP2015088686A | 2015-05-07 | |||
| JP2019046865A | 2019-03-22 |
Attorney, Agent or Firm:
Sakai International Patent Office