Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021019149
Kind Code:
A
Abstract:
To provide a semiconductor device in which accuracy of a junction position of semiconductor elements are improved and which therefore can secure high reliability.SOLUTION: A semiconductor device 103A comprises: a base 1; and a semiconductor element 3. The base 1 is made of a metal material. The semiconductor element 3 is joined by a first nanoparticle joint material 2A including at least either of silver or copper on the base 1. The metal material is formed of a material including the copper having a heat conductivity of more than or equal to 200 W/mK. The base 1 includes a surface 1t to be joined to which the semiconductor element 3 is joined. The surface 1t to be joined has size in a first direction Y which is longer than size in a second direction X being orthogonal to the first direction Y. A visible section 8 is formed at a position overlapping, in a plan view, with an end 1E extending in the first direction Y of the surface 1t to be joined.SELECTED DRAWING: Figure 3
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Inventors:
OKUDA YASUNORI
Application Number:
JP2019135398A
Publication Date:
February 15, 2021
Filing Date:
July 23, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/40; H01L21/52
Domestic Patent References:
| JP2013004880A | 2013-01-07 | |||
| JPH06314749A | 1994-11-08 | |||
| JPH1056092A | 1998-02-24 | |||
| JP2014179547A | 2014-09-25 | |||
| JP2014049640A | 2014-03-17 | |||
| JP2012134230A | 2012-07-12 | |||
| JP2017069253A | 2017-04-06 | |||
| JP2001250881A | 2001-09-14 | |||
| JPH08125076A | 1996-05-17 | |||
| JPH07135378A | 1995-05-23 |
Foreign References:
| WO2018123064A1 | 2018-07-05 | |||
| US20170365556A1 | 2017-12-21 |
Attorney, Agent or Firm:
Fukami patent office