Title:
COPPER ALLOY SHEET, COPPER ALLOY SHEET HAVING PLATING FILM AND METHOD FOR MANUFACTURING THEM
Document Type and Number:
Japanese Patent JP2021025131
Kind Code:
A
Abstract:
To provide: a copper alloy sheet including Zn and capable of enhancing solder wettability and the adhesion of a plating film; a copper alloy sheet having the plating film; and methods for manufacturing them.SOLUTION: The copper alloy sheet includes Zn of more than 2.0% (mass%, the same hereinafter) and 32.5% or less, Sn of 0.1% or more and 0.9% or less, Ni of 0.05% or more and less than 1.0%, Fe of 0.001% or more and less than 0.1%, P of 0.005% or more and 0.1% or less and the remainder consisting of Cu and inevitable impurities in the central part in the sheet thickness direction. A surface Zn concentration in the surface is 60% or less of that in the central part, and a surface layer part to a depth having 90% of the central Zn concentration from the surface has a Zn concentration increasing toward the central part in the sheet direction from the surface at a concentration gradient of 10 mass%/μm or more and 1000 mass%/μm or less.SELECTED DRAWING: Figure 2
Inventors:
MORIKAWA KENJI
MIYAJIMA NAOKI
MAKI KAZUMASA
FUNAKI SHINICHI
MIYAJIMA NAOKI
MAKI KAZUMASA
FUNAKI SHINICHI
Application Number:
JP2020133279A
Publication Date:
February 22, 2021
Filing Date:
August 05, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C22C9/04; C22F1/08; C25D5/10; C25D5/34; C25D5/50; C25D7/00
Attorney, Agent or Firm:
Masakazu Aoyama