Title:
OPTICAL SUB-ASSEMBLY AND OPTICAL MODULE
Document Type and Number:
Japanese Patent JP2021044331
Kind Code:
A
Abstract:
To achieve both of the improvement of a high frequency characteristic and the miniaturization in an optical sub-assembly in which a lead terminal is inserted.SOLUTION: An optical sub-assembly 100 includes: an eyelet 120 containing penetration holes 123A to C; a substrate mounting surface 164; a ceramic support block 162; an element mounting substrate 140 mounted on the substrate mounting surface 164 and containing a first conductive pattern 141; an optical element 160 mounted on the element mounting substrate 140 and electrically connected to the first conductive pattern 141; a pedestal base 124 having the same electric potential with the eyelet 120; a first lead terminal 110; and a relay substrate 150 mounted on the pedestal base 124 and having a second conductive pattern 152 that transmits an electric signal between the first lead terminal 110 and the first conductive pattern 141. The ceramic support block 162 contains a metallization pattern 170 which is continuously arranged from at least a part of the substrate mounting surface 164 to at least a part of a first side surface 166, and is electrically connected with the pedestal base 124.SELECTED DRAWING: Figure 3
Inventors:
NOGUCHI DAISUKE
YAMAMOTO HIROSHI
YAMAMOTO HIROSHI
Application Number:
JP2019164155A
Publication Date:
March 18, 2021
Filing Date:
September 10, 2019
Export Citation:
Assignee:
CIG PHOTONICS JAPAN LTD
International Classes:
H01S5/022
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Attorney, Agent or Firm:
Haruka International Patent Office