Title:
ABRASIVE PAD AND GRINDING METHOD
Document Type and Number:
Japanese Patent JP2021045821
Kind Code:
A
Abstract:
To provide an abrasive pad and a grinding method that are able to appropriately reduce variations in grinding rate.SOLUTION: An abrasive pad 1 grinds a workpiece fixed to a leading end of a spindle and held on a hold table. During grinding, the abrasive pad 1 is brought into contact with the workpiece held on the hold table, thereby the hold table and the abrasive pad 1 are arranged in a positional relation in which pressures applied to the workpiece differ within a plane of the workpiece. The abrasive pad 1 is formed over an outer edge 9 from a center 1-1 of a contact surface 5 of the abrasive pad 1 with the workpiece and has, between the center 1-1 and the outer edge 9, a maximum part 3-1 in which a circumferential width 4 of the contact surface 5 becomes maximum. A notch 2 is formed in the abrasive pad such that a circumferential width 4 becomes gradually wider toward the maximum part 3-1 from the center 1-1 and the circumferential width 4 becomes gradually narrower toward the outer edge 9 from the maximum part 3-1.SELECTED DRAWING: Figure 5
Inventors:
INOUE YUKI
WAKABAYASHI YOHEI
WAKABAYASHI YOHEI
Application Number:
JP2019169746A
Publication Date:
March 25, 2021
Filing Date:
September 18, 2019
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B37/26; B24B41/06; B24B49/16; H01L21/304
Attorney, Agent or Firm:
Sakai International Patent Office