Title:
THERMAL FLOWRATE SENSOR
Document Type and Number:
Japanese Patent JP2021081263
Kind Code:
A
Abstract:
To provide a thermal flowrate sensor with which it is possible to reduce costs by downsizing of a sensor substrate, and which is hardly breakable upon contact with foreign matter in a fluid.SOLUTION: The thermal flowrate sensor includes a sensor substrate 2 including a frame part 4 that encloses an open hole 6 and a sensor element support part 5 that protrudes from the frame part 4 into the open hole 6 and composed of a heat conductive material attached to a second wall 15 of a passage 11 in which a fluid 12 to be measured flows. Also included is a heat insulating material 21 which is filled in the open hole 6 so that an outer surface 5a of the sensor element support part 5 that is opposite the passage 11 is exposed. Also included is a sensor element 3 composed of a temperature sensor and a heater provided to the outer surface 5a of the sensor element support part 5.SELECTED DRAWING: Figure 4
Inventors:
IKE SHINICHI
Application Number:
JP2019207756A
Publication Date:
May 27, 2021
Filing Date:
November 18, 2019
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01F1/684
Attorney, Agent or Firm:
Shigeki Yamakawa
Masaki Yamakawa
Masaki Yamakawa