Title:
PRESSURE SYSTEM AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021093508
Kind Code:
A
Abstract:
To provide a pressure system capable of adjusting a pressure applied to a work-piece having a rough, and provide a manufacturing method of a semiconductor device.SOLUTION: A pressure system 1 comprises a pressure head 2. The pressure head 2 applies a pressure to a work-piece 100 having a rough 110. The pressure head 2 includes a plurality of pressing parts 4 in accordance with the rough 110 of the work-piece 100. Each of the plurality of pressing parts 4, includes: a measurement part 5; and an adjustment part 6. The measurement part 5 measures the pressure applied to the work-piece 100 from each pressing part 4. The adjustment part 6 adjusts the pressure applied to the work-piece 100 from each pressing part 4 in accordance with a measurement result of the measurement part 5.SELECTED DRAWING: Figure 1
Inventors:
MATSUBAYASHI MAKOTO
Application Number:
JP2019224928A
Publication Date:
June 17, 2021
Filing Date:
December 12, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L21/52; B22F7/08; H05K13/04
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office