Title:
DEOXIDANT, DEOXIDANT SOLUTION, DEOXIDANT FILM, AND DEOXIDANT FILM MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2021104490
Kind Code:
A
Abstract:
To provide a deoxidant which effectively acts under high temperature condition within a range of 200°C or more and 800°C or less and is excellent in heat resistance, a deoxidant solution containing the deoxidant and an organic solvent, a deoxidant film containing the deoxidant, and a deoxidant film manufacturing method with use of the deoxidant solution.SOLUTION: A polysilane resin, which has an organic group coupled with silicon atom via Si-C coupling and is excellent in heat resistance, is used as an active ingredient of a deoxidant. Polysilane resin preferably contains an aromatic hydrocarbon group coupled with silicon atom.SELECTED DRAWING: Figure 1
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Inventors:
IKUMA NAOHIKO
NODA KUNIHIRO
SHIODA MASARU
KOBAYASHI OSAMU
ISHIMOTO TAKAYOSHI
TACHIKAWA MASANORI
NODA KUNIHIRO
SHIODA MASARU
KOBAYASHI OSAMU
ISHIMOTO TAKAYOSHI
TACHIKAWA MASANORI
Application Number:
JP2019237243A
Publication Date:
July 26, 2021
Filing Date:
December 26, 2019
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
B01D53/14; B01J20/26
Domestic Patent References:
JP2000063760A | 2000-02-29 | |||
JPS52143996A | 1977-11-30 | |||
JPH0870000A | 1996-03-12 | |||
JP2007051253A | 2007-03-01 | |||
JPH05295563A | 1993-11-09 |
Foreign References:
WO2006077889A1 | 2006-07-27 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi