Title:
ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2021106188
Kind Code:
A
Abstract:
To provide, in a chassis structure in which two substrates are separated by a partition, an electronic apparatus capable of electrically connecting the two substrates inside the entire chassis structure.SOLUTION: The electronic apparatus comprises: a first chassis 10 on which a first substrate 61 is mounted; a second chassis 20 on which a second substrate 62 disposed opposite the first substrate 61 is mounted; a bottom plate portion 21 separating the first substrate 61 and the second substrate 62 as a partition; and an opening 24 formed in the bottom plate portion 21, through which a cable 71 connecting the first substrate 61 and the second substrate 62 is passed.SELECTED DRAWING: Figure 2
Inventors:
SHOJI MASAKAZU
NAKATA TETSUSHI
SAEKI KAZUHIKO
NAKATA TETSUSHI
SAEKI KAZUHIKO
Application Number:
JP2019235980A
Publication Date:
July 26, 2021
Filing Date:
December 26, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K7/00; H05K1/14; H05K5/02; H05K7/04
Domestic Patent References:
| JP2004253710A | 2004-09-09 | |||
| JP2005217021A | 2005-08-11 | |||
| JP2018018983A | 2018-02-01 | |||
| JP2005123257A | 2005-05-12 | |||
| JP2007308006A | 2007-11-29 |
Attorney, Agent or Firm:
Hamada Hatsune
Nakashima Shigeru
Tsujioka Masaaki
Kazuma Inoue
Nakashima Shigeru
Tsujioka Masaaki
Kazuma Inoue